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Project:

Sony, clamshell packaging for headphones

 

Scope:

Design a package configuration for a headset. Must be scanned hook capable. It has to be consistent with the current product image and make it snappy.

 

Result:

Heads up a perfect fit. Sony no balogne.

 

Materials Used:

Clear PETG, Aluminum molds, steel rule die set.

 

Production
Techniques:

In-line vacuum form and die cut.
Aluminum tooling.

 

Design:

Quality Plastic Industries.

 

Timeline:

Design two days,
tooling one week,
production parts two weeks.



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