P A C K A G I N G
Design a package configuration for a headset.
Must be scanned hook capable. It has to be consistent
with the current product image and make it snappy.
Heads up a perfect fit. Sony no balogne.
Clear PETG, Aluminum
molds, steel rule die set.
In-line vacuum form and die cut.
Quality Plastic Industries.
Design two days,
tooling one week,production
parts two weeks.