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Project:

Semiconducter Containment Cover

 

Scope:

Re-design a containment cover for the 300MM Semiconductor Processor. Incorporate vacuum form design, as well as minimize and eliminate as many welds as possible. Improve overall cosmetics, and increase functionality, to create a state-of-the-art cover. Reduce manufacturing cost.

 

Result:

Customer satisfaction, design approval, cost reduction.

 

Materials Used:

Polypropylene.

 

Production
Techniques:

Vacuum forming, Welding,
CNC Machining.

 

Design:

Quality Plastic Industries.

 

Timeline:

Design: 1 week,
Machining: 3 days,
Vacuum forming: 2 weeks



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