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Project:

Intel, SK-9 Probe card shipping container.

 

Scope:

Intel provided a list of requirements and asked for a design which could adapt those requirements. Included were the physical dimensions of the probe card,and a drop test requirement. The package had to have anti-static characteristics.

 

Result:

A "standard" was achieved. The SK-9 package design is used worldwide by Intel approved suppliers.

 

Materials Used:

PETG, ABS, Anti-static coating.

 

Production
Techniques:

Vacuum form, CNC 5 axis routering,
Anti-static coating.

 

Design:

Quality Plastic Industries.

 

Timeline:

Design: two weeks,
tooling: one week,
production parts: three weeks



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